Composite Evolution, a leading manufacturer of prepregs recently put the Evopreg PFC502 through an extensive set of tests and claimed that the bioresin complies with the Hazard Level 3 (HL3) fire standard laid down for the rail industry.
Composite Evolution’s Evopreg PFC502 are manufactured using polyfuryl alcohol (PFA) bioresin and are fire-retardant prepregs pre-impregnated with composite materials. Polufuryl alcohol is a thermosetting resin derived from crop waste. The bioresin exhibits properties similar to phenolic resin but is less toxic and accounts for lower VOC emissions. In addition to being environment-friendly, the bioresin exhibits impeccable fire-retardant properties and has a high resistance to chemicals and temperature. The PFC502 range of prepregs are being used in the manufacturing of a variety of components such as ceiling and wall panels, tables, seats, and vestibules.
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Hazard Level 3 sets of regulations are one of the most stringent set of requirements of EN45545-2 testing which are performed for materials to be used in trains that pass through enclosed structures and have no provision of side evacuations as is the case in underground metro railway systems. The EN45545-2 testing for Evopreg PFC502 was conducted by Element Materials Technology who based the tests on Requirement Sets R1, for interior surfaces, and Requirement Sets R6, for passenger seat shells. The material underwent tests such as heat release to a lateral flame spread and smoke toxicity and density test. Carbon and glass laminates manufactured using the PFA resins were tested and both met the HL3 standards.
The Evopreg PFC502 line of prepregs can be reinforced with an assortment of fabrics and fibers. The PFC502 prepregs can be specifically designed for use in marine, onshore and offshore construction, aircraft interiors, and rail interiors. A notable achievement for the company is the nomination of a lightweight rail passenger seat manufactured using the Evopreg PFC502 under the Land Transportation Category 2019 at the JEC World Awards.
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The development of multiple such environment-friendly and lightweight thermosetting molding resins are fueling the demand for thermosetting molding resin materials in the electronics industry. Lightweight, stable, and thermally resistant circuit boards are in huge demand in the electronics industry. Thermosetting resin molding materials are increasingly finding use in a multitude of electronic applications owing to their high thermal stability, good adhesive properties, and high electrical insulation. A drastic increase in the demand for printed circuit boards in the automotive industry is also a vital factor in driving market proliferation. The autonomous vehicle industry continues to evolve and the growing demand for the vehicles is estimated to contribute significantly to the growth of the thermosetting resin molding material for the electronics market. Thermosetting resins continue to find usage in a wide variety of applications such as adhesives, coatings, and lightweight materials. The resins provide improved protection against rust and corrosion making them an ideal material choice for the electronics industry. These factors are estimated to contribute to the growth of the thermosetting resins molding material for electronics market which is anticipated to be valued at US$ 1.6 billion by the end of 2026.